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300mm Resin Bond Diamond Saw Blade for Baked Tiles

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300mm Resin Bond Diamond Saw Blade for Baked Tiles

 

Product Description:

 

300mm resin bond diamond saw blade for baked tiles cutting,it has green color segment which is rough.We have different bond and different grit,such as soft,medium and hard bond. Customized product is available for us.The thin blade body guarantee the fast cutting and no chipping during the cutting period.

 

Feature:

 

Diameter: 300mm

Segment size: 2.2x10mm

Hole: 60mm

Bond: Resin bond

 

Spec.:

Diameter

Segment size

Hole

300mm

2.2x10mm

60mm

 

Tag: Cutting porcelain floor tiles  8 inch diamond blade  4 inch diamond cutting wheel

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